Our multi-material 3D printer with Selectively Plateable Technology revolutionizes electronic design by enabling the rapid creation of integrated circuits and complex circuitboards. This innovative approach allows for efficient prototyping, custom IC packaging, miniaturized sensor arrays, and flexible electronics that conform to various shapes. By streamlining the design cycle and significantly reducing costs, this technology empowers researchers and engineers to bring innovative ideas to life with unprecedented speed and flexibility.
Our multi-material 3D printer introduces a powerful feature for academic and industrial research: Selectively Plateable Technology. This innovative capability enables the efficient creation of intricate circuitboards, integrated circuits, and rapid prototypes, bridging the gap between 3D printing and electronic design.
1. Print your base structure using standard resins
2. Simultaneously print designated areas using our specialized plateable resin
3. Apply selective plating processes to create conductive pathways on the plateable areas
4. Result: A fully integrated 3D printed object with embedded circuitry
Accelerate your design cycle by quickly iterating through circuit layouts. Create multilayer boards with intricate traces and vias, allowing for immediate testing and refinement of new designs.
Develop specialized IC packages by combining 3D printed structures with embedded circuit pathways. This technology enables the creation of optimized housings for unique chip designs or multi-chip modules.
Design and fabricate compact sensor systems with tightly integrated electronics. The ability to create 3D structures with precisely positioned circuit elements allows for innovative approaches to sensor miniaturization.
Explore new form factors for electronic devices by printing flexible substrates with integrated circuitry. This approach opens up possibilities for creating electronics that conform to complex shapes or dynamic surfaces.
Rapidly iterate through antenna designs by 3D printing structures with selectively plated conductive elements. This method allows for quick testing and optimization of novel antenna geometries for various applications.
By leveraging Selectively Plateable Technology, researchers and engineers can significantly reduce the time and cost associated with circuitboard and IC prototyping. From developing next-generation IoT devices to creating custom scientific instruments, this technology offers unprecedented flexibility in electronic design and fabrication.
Equip your lab or prototyping facility with our multi-material 3D printer – where additive manufacturing precision meets the demands of modern electronic design. Accelerate your development cycle and bring innovative ideas to life with unparalleled efficiency.